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0 (hodnocen0 x )
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EB
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ONLINE
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Pfaffikon, Switzerland : TTP, 2014
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Enfield, New Hampshire : Trans Tech Publications Ltd, [date of distribution not identified]
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1 online resource (119 pages) : illustrations
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Externí odkaz
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Plný text PDF
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* Návod pro vzdálený přístup
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ISBN 9783038266365 (electronic bk.)
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ISBN 9783038352525
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Advanced Materials Research, ISSN 1662-8985 ; Volume 1038
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Print version: International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany) 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland : TTP, c2014 124 pages Advanced materials research ; Volume 1038. ISBN 9783038352525
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Includes bibliographical references at the end of each chapters and index
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001785419
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full
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(Au-PeEL)EBL1910949
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(CaPaEBR)ebr10951273
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(MiAaPQ)EBC1910949
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(OCoLC)893677821
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