|
|
.
|
|
|
0 (hodnocen0 x )
|
|
|
EB
|
|
|
ONLINE
|
|
|
|
|
|
|
|
|
Hoboken, N.J. : Wiley, 2011
|
|
|
1 online resource (xxii, 564 p.) : ill
|
| Externí odkaz |
 Plný text PDF
|
|
* Návod pro vzdálený přístup
|
|
|
|
|
|
|
|
|
|
ISBN 9780470827819 (electronic bk.)
|
|
|
ISBN 9780470828410 (electronic bk.)
|
|
|
ISBN 9780470827802 (hardback)
|
|
|
ISBN 9780470827826 (oBook)
|
|
|
ISBN 9781118082829 (Mobi)
|
|
|
|
|
|
Includes bibliographical references and index
|
|
|
pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.
|
|
|
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher..
|
|
|
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries
|
|
|
|
|
|
|
|
|
001735719
|
|
|
full
|
|
|
(Au-PeEL)EBL818629
|
|
|
(CaONFJC)MIL462692
|
|
|
(CaPaEBR)ebr10494525
|
|
|
(MiAaPQ)EBC818629
|
|
|
(OCoLC)756280855
|
Dotazy a připomínky