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0 (hodnocen0 x )
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EB
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ONLINE
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Hoboken, NJ : Wiley, 2019
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1 online resource (xxvii, 548 pages) : illustrations
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 Plný text PDF
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* Návod pro vzdálený přístup
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ISBN 9781119313977 (electronic bk.)
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ISBN 9781119314134
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Print version: Advances in embedded and fan-out wafer level packaging technologies. Hoboken, NJ : Wiley, 2019 xxvii, 548 pages ISBN 9781119314134
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Includes bibliographical references and index
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001882237
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full
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(Au-PeEL)EBL5720829
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(MiAaPQ)EBC5720829
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(OCoLC)1089612468
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Dotazy a připomínky